Tech

Scientists "light up" dark excitons for the first time: originally invisible quantum states finally

20 November 2025

For the first time, scientists have successfully made dark excitons that were almost unobservable light up. The latest results of a research team from the City University of New York and the University of Texas at Austin were published in Nature Pho...

AMD estimates profit growth to more than triple in five years at first analyst day in three years

14 November 2025

Chip manufacturer AMD held its first analyst day event in three years in New York on the 11th, at which it announced extremely optimistic financial expectations and market outlook. AMD said its annual profits will more than triple in the next three...

Nexperia s impasse remains unresolved, German automakers raise chip shortage alert again

11 November 2025

China has imposed export licensing controls on some chips and components from Nexperia of the Netherlands, affecting the German automotive supply chain. German media pointed out that each car manufactured by European automakers contains an average o...

EUV mask inspection equipment manufacturer Lasertec’s net profit doubled, stock price surged 11%

7 November 2025

With the support of AI demand and the strong demand for semiconductor-related equipment, EUV mask inspection equipment manufacturer Lasertec doubled its net income last quarter, which was better than market expectations. Today's stock price soar...

Mimicking brain reactions, new artificial neural chip debuts

4 November 2025

A team from the University of Southern California (USC) has developed a diffusive memristor that can simulate the electrochemical behavior of human brain neurons and produced a prototype chip that integrates multiple neurons. Relevant results were p...

Licheng: Capital expenditure next year is expected to be 40 billion yuan, focusing on FOPLP expansio

31 October 2025

Cai Dukong, chairman of semiconductor packaging and testing factory Licheng, said today that Licheng will actively expand fan-out panel packaging (FOPLP) production capacity in 2026, with an investment scale of US$1 billion. In order to cooperate wi...

SK Hynix’s second generation A-Die DDR5 chip exposed! Native frequency up to 7,200MT/s

28 October 2025

The new SK Hynix DDR5 memory chip recently appeared on the Internet. It is said to be code-named "X021" and carries a new "AKBD" part code. According to foreign media WCCFtech, the chip first appeared in the Facebook public commu...

The first Blackwell wafer is produced in the United States, and Jen-Hsun Huang visited TSMC’s U.S. f

23 October 2025

NVIDIA launched its first Blackwell wafer manufactured in the United States on the 17th, produced at TSMC Arizona's Arizona wafer fab (TSMC Arizona), marking a new milestone. NVIDIA founder and CEO Jensen Huang also attended the celebration cere...

Tokyo Weinig Kumamoto R&D Center opened, targeting 1 nanometer-level process equipment

19 October 2025

According to Nikkei reports, Japanese semiconductor equipment giant Tokyo Weini Technology announced on October 15 that its new RD Building (Process Development Building) in Kumamoto has been officially completed and will serve as the company’s core...